欧美性猛交XXXX

       
      OSP
       
      Surcoat
       
      Cu-Coat GVIII
       
      ZA 200 Microetchant
       
      ECHEM Copper microetchant
       
      EZ-GF0310
       
      Antioxidants





















      ECHEM High resistant Lead-free organic solderability preservatives (OSP)

       
       Product Description

      Surcoat T / TX is an organic copper protective agent that has excellent heat resistance and moisture resistance properties. It is a water-soluble preflux specifically designed for heat and welding resistance of lead-free (Sn / Cu / Ag) solder surface of the printed circuit board.

      Surcoat T / TX is also an organic OSP specifically designed for the lead-free soldering process that can withstand the impacts of high-temperature lead-free soldering (Peak Temp. 260 ℃, 3 times or more) several times and still retains excellent copper solder surface resistance (0.9 ~ 1.1? aperture PTHs, 99 ~ 100% rate on the tin).



       Product Advantages
      low manufacturing cost, extend the life of the bath
      Surcoat TX is suitable for copper/gold mix board, and can    operate without taping
      excellent flatness and pore uniformity
      bath solution is less prone to crystallization and does not    produce oil
      suitable for surface copper treatment of wafer package
      great heat resistance -(260℃/ IR-Reflow more than 3 times)
       
      short processing time for T/TX bath
      maximum allowable limit of copper ions in a bath
      comply with environmental requirements
      compatible with disposable processes
      simple procedures and reduces cost

       


       Surcoat OSP Operations flowchart    Maximum yield per unit
      Surcoat OSP Sn 96.5%/Ag 3.0%/Cu 0.5% Solder
      Flow-up Ratio for PTHs
       Comparison chart of tolerance of
       copper ions in anti-gold solution
       


       Surcoat OSP Operation Flowchart

       



      欧美性猛交XXXX